Features:

1. Compact Design: Wire bonding allows for a compact design, as the LED chips are mounted directly on the PCB without the need for individual packages. This makes COB LED displays ideal for applications where space is limited

2. High Density Packaging: The wire bonding technique allows for high-density packaging, enabling more LED chips to be mounted on the PCB. This results in higher pixel density and improved image quality

3. Improved Heat Dissipation: The direct mounting of LED chips on the PCB allows for better heat dissipation compared to traditional LED displays. This helps in maintaining the longevity and reliability of the display screen

4. Enhanced Performance: The direct wire bonding connections provide reliable electrical connections, resulting in improved performance of the LED module display. This ensures stable and consistent illumination over time

5. Lower Power Consumption: COB LED displays typically have lower power consumption compared to other display technologies, making them energy-efficient and cost-effective in the long run

6. Wide Viewing Angle: COB LED module screens offer a wide viewing angle, ensuring good visibility from various positions and angles. This makes them suitable for applications that require a large audience or multiple viewers

7. Customization Options: Wire bonding COB LED displays offer versatility in terms of customization. The number and arrangement of LED chips can be tailored to meet specific requirements, such as different sizes, shapes, and resolutions

8. Durability: COB LED module displays are known for their durability and resistance to shocks, vibrations, and environmental factors. This makes them suitable for rugged applications

Specification：